Welcome to the next generation in PWB test solutions. We combine an exceptional team of technology and applications experts with HIOKI's industry-leading systems to enhance your reliability and to speed up your product development process.
Industry Directory | Manufacturer / Other
We design and manufacturer high-precision dies for FPC products in Customer's Specifications or provided CAD files.ISO9001:2000 certificated.By now, we have export our dies to siflex in Korea, qdos in Malaysia,canon,yokowo,clarion,pioneer in Japan etc...
JUKI RS-1R Next Generation Smart Fast Modular Mounter Model JUKI RS-1R Pick and Place Machine Conveyor Specification standard Boar Size minimum 50*50mm 1 buffer 650*370mm(single clamping) 9
JUKI RS-1R Next Generation Smart Fast Modular Mounter JUKI RS-1R is one of the new models of the JUKI Pick and Place Pachine, JUKI RS-1R smart modular mounter SMT Placement, JUKI SMT mounter, JUKI chip shooter, JUKI Chip Mounter speed can reach 47,0
Electronics Forum | Wed Jun 07 21:54:11 EDT 2006 | mumtaz
Ha ha! davef finishes you guys off again!
Electronics Forum | Wed Jun 07 22:02:57 EDT 2006 | davef
Similarly, we have eliminated solder balls by using an aqueous washer.
Used SMT Equipment | Flexible Mounters
Product Name: Samsung chip mounter CP45FV04 Product number: CP45FV04 Detailed product introduction Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max speed IPC9580, 14900CPH 0.178sec/chip (1608); IC flying camera 0.75s
Used SMT Equipment | Pick and Place/Feeders
Product name: KE - 2060L JUKI chip mounter Product number: KE - 2060L JUKI2060 chip mounter parameters: Mounting head: 3 Material stand: 80 Mount speed: 0.25 SEC/CHIP (3 head at thesame time put in the attached SMT) Mounting speed:+ / - 0.. 5 M
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2003-03-20 08:12:57.0
Nichicon has increased the top capacitance value of its WG series of surface mount electrolytic capacitors from 1000 to 1500uF.
Parts & Supplies | Pick and Place/Feeders
Device description: Machine Model: NXT-M3 Machine year: 2007 PCB Size: Minimum: 48mm X 48mm Max: 510mm X 534mm(dual track) Patch speed: H12HS: 22,500; H08:10,500; H04:6,500; H01:4,200 Paste accuracy: H12S/H08 / H04 :0.05 mm(3sigma) cpk ≥ 1.00 T
Parts & Supplies | Assembly Accessories
KIC START profiler,kic thermal profile,smt thermal profilling Image Reflow Profile 9 6 Channel Tester Accuracy: +/-1.2°C Resolution: 0.3 °C to 0.1 °C Internal operating temperature: 0 °C to 105 °C For thermocouples: 9/12 K Ty
Technical Library | 2023-12-18 11:33:57.0
Elevate your electronic manufacturing game with the I.C.T-D600 SMT Dispensing Machine! Precision, safety, and efficiency in one powerful solution. In the dynamic realm of electronic manufacturing, precision and efficiency are not just preferences but essential requirements. Introducing the I.C.T-D600, an automatic glue dispenser machine engineered to enhance production processes across various applications. From chip encapsulation to PCB assembly, SMT red-glue dispensing, LED lens production, and medical device creation, SMT dispensing machine is a versatile solution tailored to meet the demands of the industry. Essential Attributes Of The I.C.T-D600 Automatic Glue Dispenser Machine 1. Compliance with European Safety Standards: The I.C.T-D600 SMT dispensing machine prioritizes not only efficiency but also safety, boasting compliance with European safety standards and holding a CE certificate. This ensures a secure and reliable manufacturing environment, aligning with global quality benchmarks. 2. International Component Quality: Internationally renowned components form the core of the D600 SMT dispensing machine. From Panasonic servomotors to MINTRON CCD, each element is carefully selected, guaranteeing high performance and durability. This commitment to quality components results in a machine that operates seamlessly, reducing downtime and maintenance costs. 3. Impressive Performance Metrics: The SMT dispensing machinedoesn't just meet expectations; it surpasses them with exceptional performance metrics: Maximum Guide Rail Speed: 400mm/s Fastest Injection Valve Speed: 20 spots/sec Dispensing Accuracy: ±0.02mm Repeated Accuracy: ±0.01mm Machine Characteristics: Core Part – Jet Valve The non-contact jet dispensing method ensures high-speed operation (max jet speed: 20 spots/second), high accuracy with a minimum dispensing volume of 5nl, and flexibility with extremely small dispensing volumes. The thermostatic system for the flow channel and sprayer ensures uniform glue temperature, resulting in low maintenance costs and an extended service life. Enhanced Capacity: Non-contact jet dispensing eliminates the need for Z-axis motion. Integrated temperature control technology reduces manual intervention. Automatic glue compensation minimizes artificial regulation time. Dual-track design reduces waiting time. Automatic visual location identification and compensation. Non-contact height detection with laser reduces height detection time. Flexibility: Capable of handling substrates or backings of various sizes. Optional heating module. Independent control of dual tracks with user-friendly software. Fast switching between different product lines. Universal platform suitable for various processes with different glues
Technical Library | 2023-05-02 19:16:57.0
1.5 with a 150μm specification window. For 0201 components, the minimum requirement is CpK > 2.0 with a 100μm specification window. The spec window may need to be reduced down to 75μm if the controls for high volume manufacturing are insufficient. Also directly impacting the placement quality is the ability to apply sufficient solder consistently to the board. The goal is to maintain current printing practices, but the effect of powder size will be examined. This paper will evaluate the impact of placement accuracy and solder powder size on 0201 manufacturing quality.
SMT Semi Auto Screen Printer for pcb size 1200 in smt LED production line Product introduction: 1.Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. 2.Printing scraper can rotate 45
Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Training Courses | ON DEMAND | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Tue Jan 24 08:00:00 EST 2017 - Thu Jan 26 16:30:00 EST 2017 | Atlanta, Georgia USA
PLC Training Seminar
Career Center | St. Charles, Illinois USA | Engineering,Maintenance,Production
An established Contract Electronics Mfg. in the Western Suburbs of Chicago is looking for an individual that values hard work and understands the opportunity of working with a mid-sized company for growth potential. Long-term full-time position 8:00a
Career Center | Fremont, California USA | Engineering
Interprets electrical design requirements and uses Allegro design tool to create original PCB layouts, detailed fab drawings, schematics, and other design files. Work with HW design engineer to make sure PCB layout meet PCB design requirements.
| https://www.feedersupplier.com/sale-13119219-hitachi-hg51-nozzle-6301599632-smt-machine-parts-medium-size.html
Hitachi HG51 Nozzle 6301599632 SMT Machine Parts Medium size Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
Lewis & Clark | http://www.lewis-clark.com/product-tag/assembleon-pick-place/
) • Maximum board size (L x W – (18.1″ x 17.3″) • Minimum board size (L x W) -(2″ x 2″) • Board thickness – 0.4 to 4.0mm (0.016″ x 0.16″) Condition: Complete & Operational Location
